Today is created by the challenge toward “impossible”.

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HYPER Spec Machine

Hashrate : normal

Power Consumption

Power Efficiency

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Eco Spec Machine

Hashrate : normal

Power Consumption

Power Efficiency

Reached the ideal design for the mining
through trial and error.

Optimize the balance of the “processing capacity” and the “electricity consumption” of the mining by being thorough in the circuit optimization, depending on several conditions. Designed for maximizing the mining profitability.

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The chip used in the 7nm process technology has realized a several times higher densification as the conventional chips (16nm) for the mining. The mining ability has realized twice as much as the “processing capability” and has a major improvement in the “electricity consumption” .

The high coolability

The conventional machines’ air cooling system has been radically re-examined and much higher coolability has been realized by using the structure (Flip Chip BGA packaging) which the chip exposes on the package.

The miniaturization of the mining system

The miniaturization of the mining system was successful as well. By equipping 4 boards which is one board more than the conventional machine, the mining ability per unit has improved more than the conventional ones.

7 nm ASIC Chip
The development schedule

  • The end of February 2017

    Commencement of a discussion on the development specification

  • Early in June 2017

    Commencement of the RTL coding

  • The end of September 2017

    Completion of the RTL coding

  • Early in October 2017

    Completion of the confirmation of the FPGA operation

  • The end of November 2017

    Completion of the tuning towards the RTL 7nm process

  • Early in December 2017

    Commencement of the physical design

  • The end of February 2018

    Completion of the physical design

  • Early in March 2018

    Tape Out

  • May 2018

    The first stage mass production of WAFER will be injected.

  • Mid in August 2018

    The sample chip will be delivered.

  • The end of September 2018

    The sample unit will be delivered.

  • Mid in October 2018

    The first stage mass production of chips will be delivered.

  • The end of November 2018

    The first stage mass production of units will be delivered.

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CREATE THE
NEXT WORLD.

TRIPLE-1 will be pioneering the future of the world
blockchain, taking advantage of Japanese craftsmanship.