Product

KAMIKAZE

It is the origin of "KAMIKAZE" that shocked the world in 2018. At the earliest stage, the 7nm process was full of risks, yet we boldly utilized it and changed the industry's standard norm. This challenge, widely seen as reckless, became the standard.

Status
Mass-production
Technology
TSMC 7nm
Die Size
3.5 × 3.9mm
Package
FCBGA( 7 × 7 mm )
Efficiency
52 W/ THs
Remarks
-

KAMIKAZE II

It's the latest achievement continuing the will of "KAMIKAZE". It's a new design that deals with the scattering of the 7nm process. This reckless challenge becomes the standard again.

Status
Release in 2020
Technology
TSMC 7nm(Improved ver.)
Die Size
3.0 × 9.0mm
Package
FCLGA( 7 × 12 mm )
Efficiency
28 W/ THs
Remarks
ASIC-Boost

GOKU

The genes of "KAMIKAZE" is now spreading to the AI field. After being the first one to adopt the still developing 5nm process, we will create a stir in the AI energy issues. We will continue to make challenges that people call reckless into the norm again.

Status
Release in 2021
Technology
5nm
Die Size
33.0 × 26.0 mm
Package
HFCBGA( 50 × 50 mm )
Efficiency
100 W/ PFLOPS
Remarks
High-speed I/F

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