Product
KAMIKAZE
It is the origin of "KAMIKAZE" that shocked the world in 2018. At the earliest stage, the 7nm process was full of risks, yet we boldly utilized it and changed the industry's standard norm.
- Status
- Mass-production
- Technology
- TSMC 7nm
- Die Size
- 3.5 × 3.9mm
- Package
- FCBGA( 7 × 7 mm )
- Efficiency
- 52 W/ THs
- Remarks
- -
KAMIKAZE II
It's the latest achievement continuing the will of "KAMIKAZE". It's a new design that deals with the scattering of the 7nm process.
- Status
- Release in 2020
- Technology
- TSMC 7nm(Improved ver.)
- Die Size
- 3.0 × 9.0mm
- Package
- FCLGA( 7 × 12 mm )
- Efficiency
- 28 W/ THs
- Remarks
- ASIC-Boost
GOKU
The genes of "KAMIKAZE" is now spreading to the AI field. After being the first one to adopt the still developing 5nm process, we will create a stir in the AI energy issues.
- Status
- Release in 2021
- Technology
- 5nm
- Die Size
- 33.0 × 26.0 mm
- Package
- HFCBGA( 50 × 50 mm )
- Efficiency
- 100 W/ PFLOPS
- Remarks
- High-speed I/F